The exponential growth in AI compute demands energy-efficient and scalable optical networks. In this talk, we will look into AI networks and focus on the Design & Technology Co-optimization aspect of designing 400G+ bps optical links.
The Rodgers RLE Forum is a time to appreciate and learn from examples of impactful engineering. The laboratory hosts these opportunities for engagement in support of its mission to serve as a cutting-edge hub for advancing and sharing knowledge and best practices in high-performance prototyping.
About the presenters:
Dr. Shenggao Li is a Director at TSMC, San Jose, California, focusing on chiplet, 3D-IC, and optical Interconnects. Prior to TSMC, he spent 20 years at Intel leading PCIe physical layers for the Xeon/Core family of microprocessors. Dr. Li is a Co-chair of the Form Factor & Compliance Working Group of the UCIe (Universal Chiplet Interconnect Express) Consortium and recently initiated the UCIe 4.0 proposal. He is also a TPC co-chair of the IEEE CICC’26 Seattle.
TSMC is the unrivaled leader in advanced process technologies, including 3nm, and 2nm manufacturing, and advanced packaging technologies such as CoWoS, InFO, and SoIC. Founded in 1987 by MIT graduate Morris Chang, TSMC currently holds a market cap of $1.53T USD.