PCB Fabrication, Assembly & Rework

Owned by Professor Kevin Chen and administered by the Rodgers Lab, this 355 nm, up to 6 W laser is capable of 25 to 300 kHz rep. rates for cutting or etching a variety of metals and composite materials.

• SmartHeat Power on Demand Technology
• Patented Connection Validation IMC Formation Technology
• 2.8″ color touchscreen with bold graphics
• Communications Port for process traceability data and firmware graphics
• Integrated Net Power Meter and power graph
  • With optional precise tip temperature display
• Patented Chip-in-Cartridge technology
  • Closed loop bi-directional communication
  • Stores and records cartridge attributes
  • Provides traceability information
  • Protects power supply from non-conforming cartridges
  • Backwards compatible with MX series power supplies
• Password protection​

Pick and place, reflow, rework.

For many of today’s chip packages, both initial placement and rework can be challenging. The Scorpion Rework System allows for simultaneous viewing of PC board pads and component pads or balls for accurate alignment BEFORE placement. The image of the chip leads or bottom contacts, including BGA solder balls, is overlaid with that of the PC board pattern at seven selectable magnifications from 20X to 50X. The image is viewed on the computer monitor and fine adjusted with micrometers on the board holder. Finally, the part is placed and the vacuum is released. 

After accurate component placement is achieved, the vacuum pickup tube is retracted and a reflow nozzle is lowered into place. At this point, the component is subjected to a user-customizable multizone, convection-reflow profile. Whether for an original assembly or a rework task, the profile can be user-customized and specifically tailored to the joint requirements of a particular PCB, device and solder paste.

This is a 2005 vintage flip-chip bonder using hot air and pressure, for reflow of solder paste, BGA and soft-metal bump bonding. The optics and placement system are spec’ed for as small as 0.5 um lead/pad pitch. Prior users have reported attainment of 5 um accuracy with little trouble.

• Click here for a document with part numbers, drawings and dimensional information
• Compatible with UFC series tips
  • 600 series – 675°F, for temperature sensitive applications
  • 700 series – 775°F, for most standard applications

• Tips sold separately 
• Compatible with CVC cartridges 
  • 500 Series – 575°F, for temperature sensitive applications
  • 600 Series – 675°F, for temperature sensitive applications
  • 700 Series – 775°F, for most standard applications
  • 800 Series – 875°F, for ceramic/high thermal demand applications
  • 900 Series – 925°F, for ceramic/high thermal demand applications
• Compatible with SMC cartridges
  • 500 series – 575°F, for temperature sensitive applications
  • 600 series – 675°F, for temperature sensitive applications
  • 700 series – 775°F, for most standard applications
  • 800 series – 875°F, for ceramic/high thermal demand applications

CARTRIDGE, CONICAL, BENT, 0.2MM X 5.6MM X2

Simul-Focal Stereo Zoom Microscope on Boom Stand with an LED Light and 16MP USB3 Camera connected to a networked computer.

CARTRIDGE, CONICAL, 0.13MM X 5.1MM

CARTRIDGE, POWER WEDGE, 0.31MM X 5.0MM X2