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LPKF Contac S4

The Contac S4 is used for through-hole plating of PCBs and for galvanic strengthening of copper surfaces. This creates an electric connection between the different layers of the PCB. The through holes can have a minimum diameter of 0.2 mm (> 8 mil) and are plated.

The system is suited for processing double-sided and multi-layer PCBs. The process consists of the following six phases:

1. Cleaning the PCB

2. Conditioning th PCB

3. Activating the PCB

4. Active-cleaning the PCB

5. Copper-plating the PCB

6. Tin-plating the PCB

The fifth phase uses an air injection to create a more homogeneous copper deposition on the surface of the PCB.

The active-cleaning of the drilled holes after applying activation solution enabled bonding of the copper to the inner copper layer. This is especially important for plating micro vias and blind vias. The tin-plating option is intended for applying a tin layer on copper surfaces of PCBs. The tin layer is chemically deposited, i.e. without electric current, and is intended to protect the copper surface against corrosion and to improve solderability. This also ensures further processing after a period of storage.

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